首页> 外国专利> Non-conductive electroplating substrate prepn. - by forming dispersion contg. carbon black on surfaced and separating to disperse carbon black before electroplating

Non-conductive electroplating substrate prepn. - by forming dispersion contg. carbon black on surfaced and separating to disperse carbon black before electroplating

机译:非导电电镀基材的制备。 -通过形成分散体。电镀前在表面沉积炭黑并分离以分散炭黑

摘要

Process for electroplating a conductive metal to a non-cnctiv non-conductive material comprises: a) preparing a liq. dispersion of carbon black; b) applying the dispersant to the non-conducting material surface; c) sepg. all of the dispersant from the carbon black thus depositing a continuous layer onto the non-conductive surface; and d) electroplating a continuous conducting metal layer upon the carbon black/non conductive layer. - The liq. dispersion of carbon black consists of: i) carbon black particles with an av. dia. of up to 30 um in the dispersion; ii) an effective dispersing amt. of surfactant; and iii) liq. dispersing medium.
机译:将导电金属电镀到非导电非导电材料的方法包括:a)制备液体。炭黑的分散b)将分散剂施加到非导电材料表面上; c)隔膜来自炭黑的所有分散剂,从而在非导电表面上沉积了一层连续的层; d)在炭黑/非导电层上电镀连续的导电金属层。 -酒。炭黑的分散体包括:i)具有av的炭黑颗粒。直径分散液中最多30 um; ii)有效的分散剂。表面活性剂和iii)liq。分散介质。

著录项

  • 公开/公告号BE905660A2

    专利类型

  • 公开/公告日1987-02-16

    原文格式PDF

  • 申请/专利权人

    申请/专利号BE19862061079

  • 发明设计人

    申请日1986-10-27

  • 分类号

  • 国家 BE

  • 入库时间 2022-08-22 07:21:46

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