A process for preparing a non-aqueous epoxy resin dispersion

摘要

Non-aqueous dispersions are disclosed which contain (A) a relatively high molecular weight epoxy resin, (B) a non-aqueous dispersion medium, and (C) a dispersant such as a copolymer of (1) at least one polymerizable ethylenically unsaturated monomer containing a group reactive with an epoxy group and (2) at least one polymerizable ethylenically unsaturated monomer free of any groups reactive with an epoxy group. These dispersions are useful in coatings, electrical or structural laminates or composites, body solders, adhesives, caulking compounds, casting compounds, filament winding and the like.