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Engaging second articles to engaged first articles

机译:让第二篇文章参与第一篇文章

摘要

A head (45) engages a chip (10) having peripheral sides (16), and then engages the chip (10), to a workpiece (35) for bonding chip (10) to a substrate (30). Body (46) has a lower portion terminating in a downwardly presented, working face (48). For receiving chip (10), face (48) has a cavity (54) formed by a plurality of inwardly and upwardly directed surfaces (56). Such surfaces (56) engage upper edges of, and position a chip (10) such that at least a portion of the peripheral sides (16) protrude from working face (48). Body (46) includes a vacuum bore (58) adapted for connection between face (48) and a vacuum for removably engaging and holding chip (10) against surfaces (56). Pockets (60) are also provided in face (48) and connected to a vacuum for moving air streams toward face (48) at the sides (16) of an engaged chip ( 10). Such streams are sufficient in force, direction and distribution around the sides (16) that when an engaged chip (10) is moved adjacent to a free workpiece (35), the air streams capture portions (38) and hold workpiece (35) against chip (10). The chip (10) and the workpiece (35) may be simultaneously registered to a site (32) on a heated substrate (30). Then workpiece (35) becomes liquefied and is uniformly applied and reacted to contact surfaces for the bonding. The pockets (60) may be directly supplied by the same vacuum for engaging chip (10) or to a different vacuum. Alternatively, the pockets (60) may open into cavity (54) such that a vacuum sufficient to engage chip (10) and then the workpiece (35).
机译:头部(45)接合具有外围侧(16)的芯片(10),然后将芯片(10)接合至工件(35),以将芯片(10)接合至基板(30)。主体(46)的下部终止于向下呈现的工作面(48)。为了容纳芯片(10),表面(48)具有由多个向内和向上指向的表面(56)形成的空腔(54)。这些表面(56)接合切屑(10)的上边缘并定位切屑(10),使得至少一部分外围侧面(16)从工作面(48)突出。主体(46)包括适于在面(48)之间连接的真空孔(58)和用于将芯片(10)可移除地接合并保持在表面(56)上的真空。还在表面(48)中提供了凹穴(60),该凹穴(60)连接至真空,以使空气流在接合的芯片(10)的侧面(16)处朝向表面(48)移动。这样的气流在侧面(16)周围具有足够的力,方向和分布,使得当接合的切屑(10)邻近自由工件(35)移动时,气流捕获部分(38)并使工件(35)抵靠筹码(10)。芯片(10)和工件(35)可以同时对准到加热的基板(30)上的位置(32)。然后,工件(35)被液化并被均匀地施加并反应到用于粘合的接触表面上。口袋(60)可以由用于接合芯片(10)的相同真空直接提供或提供给不同真空。替代地,凹穴(60)可以通向腔(54),使得真空足以接合芯片(10),然后接合工件(35)。

著录项

  • 公开/公告号US4634043A

    专利类型

  • 公开/公告日1987-01-06

    原文格式PDF

  • 申请/专利权人 AT&T TECHNOLOGIES INC.;

    申请/专利号US19840652388

  • 发明设计人 MICHAEL K. AVEDISSIAN;

    申请日1984-09-20

  • 分类号B23K31/02;

  • 国家 US

  • 入库时间 2022-08-22 07:09:49

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