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procedure for the removal of lead / tin, lead or tinlag from copper or nikkeloverflader and badoploesninger for use thereby
procedure for the removal of lead / tin, lead or tinlag from copper or nikkeloverflader and badoploesninger for use thereby
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机译:从铜或尼克尔络合剂和Badoploesninger中去除铅/锡,铅或锡的程序
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摘要
An etch solution for removing lead/tin, lead or tin layers applied to copper or nickel surfaces consists of nitric acid and contains one or more inhibitor(s) such as block copolymers of propylene oxide and ethylene oxide or polyethylene glycols and/or polyols having a molecular weight greater than 2000.
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