首页> 外国专利> Conductor track film for application onto printed circuit boards, and use of the conductor track film for holding electrical components using surface mounting technology (SMT)

Conductor track film for application onto printed circuit boards, and use of the conductor track film for holding electrical components using surface mounting technology (SMT)

机译:用于印刷电路板上的导体走线膜,以及使用表面安装技术(SMT)的导体走线膜用于固定电气组件的用途

摘要

The invention relates to a conductor track film for application onto printed circuit boards and to use of the conductor track film for holding electrical components using surface mounting technology (SMT). Using the specified carrier films, a trial layout with printed circuit boards for surface mounting technology can be produced in a simple manner without having to etch the conductor tracks and the connecting points. The invention is used in laying out experimentation boards in surface mounting technology (SMT). IMAGE
机译:导体迹线膜技术领域本发明涉及一种用于印刷电路板上的导体迹线膜,并且涉及该导体迹线膜用于通过表面安装技术(SMT)保持电气部件的用途。使用指定的载体膜,可以以简单的方式生产带有用于表面安装技术的印刷电路板的试验版图,而不必蚀刻导体轨迹和连接点。本发明用于在表面安装技术(SMT)中布置实验板。 <图像>

著录项

  • 公开/公告号DE3629871A1

    专利类型

  • 公开/公告日1988-03-10

    原文格式PDF

  • 申请/专利权人 SIEMENS AG;

    申请/专利号DE19863629871

  • 发明设计人 THIEMEROLAND;

    申请日1986-09-02

  • 分类号H05K1/09;H05K3/20;

  • 国家 DE

  • 入库时间 2022-08-22 06:52:14

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