ION-IMPLANTING METHOD AND APPARATUS WITH IMPROVED ION-DOSE ACCURACY

摘要

The implant chamber pressure during ion implantation is controlled within a specified intermediate pressure range higher than the baseline pressure. Implanted dose errors resulting from neutralizing collisions of the beam with residual gas molecules are held constant and can be compensated. The pressure is maintained within the specified intermediate pressure range by a control system including a controllable vacuum valve associated with a vacuum pump, a chamber pressure sensor and a valve controller responsive to the pressure sensor. The valve controller opens and closes the valve to maintain the chamber pressure within the specified range after introduction of a wafer.