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Chip carrier for enabling production of high performance microwave semiconductor device by disposing semiconductor chip thereon
Chip carrier for enabling production of high performance microwave semiconductor device by disposing semiconductor chip thereon
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机译:通过在其上布置半导体芯片而能够生产高性能微波半导体器件的芯片载体
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摘要
A chip carrier (2) comprises a conductive holder (21) having a chip mounting portion (20), and a insulative collar member (22) having an inner portion.The conductive holder (21) is used to mount a semiconductor chip (1) on the chip mounting portion (20). The shape of the inner portion of the insulative collar member (22) is suitable for an outer shape of the semiconductor chip (1). The insulative collar member (22), which is provided at the periphery of the conductive holder (21), is used to position the semiconductor chip (1). Consequently, the handling of the semiconductor chip (1) having a feeble mechanical strength can be converted to the handling of the chip carrier (2) having a hard mechanical strength, so that the semiconductor chip (1) can be easily mounted on a exact portion of a surface of the package (4) without breaking the semiconductor chip (1).
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