Power diode with semiconductor chip between head wire and metal socket - has mounting connecting power diode to sheet metal heat sink via heat conducting plastics material

摘要

The power diode has a semiconductor chip between a head wire and a metal socket on the side away from the head wire, secured to a sheet metal plate heat sink. The metal socket (1) is welded to the heat sink (4). Pref. the diode is surrounded by a protection casing (6), set on the metal socket. Alternately the power diode may be embedded without the socket in a shaped depression of the heat sink, with the chip (2) secured to the heat sink with its free surface. The semiconductor chip may be sodlered to a copper platelet welded to the depression bottom. The sheet metal plate acting as the heat sink has the depression for the diode, with the depression edge embossed inwards. ADVANTAGE - Improved heat convection and heat resistant connection between the diode and the sheet metal plate.