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PRE-ENGINEERED ELECTRODE/DIELECTRIC COMPOSITE FILM AND RELATED MANUFACTURING PROCESS FOR MULTILAYER CERAMIC CHIP CAPACITORS
PRE-ENGINEERED ELECTRODE/DIELECTRIC COMPOSITE FILM AND RELATED MANUFACTURING PROCESS FOR MULTILAYER CERAMIC CHIP CAPACITORS
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机译:多层陶瓷芯片电容器的预工程化电极/介电复合膜及其制造工艺
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摘要
To manufacture multilayer ceramic capacitors are used shaping techniques of the electrodes and densifying the layers. The capacitors manufactured in this manner have electrodes (12) and dielectric layers (14) are uniform, while being thinner and flatter than the electrodes and the dielectric layers manufactured according to the techniques used so far. An electrode pattern is printed on a coated sheet of separation (10) and is then calendered. A dielectric layer covering the electrode pattern and is then calendered, thereby forming a green sheet on the recessed electrode. The green sheet is then stacked on other green sheets recessed electrode formed in the same manner and then the stack is laminated and crude capacitors are separated from the stack.
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