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PRE-ENGINEERED ELECTRODE/DIELECTRIC COMPOSITE FILM AND RELATED MANUFACTURING PROCESS FOR MULTILAYER CERAMIC CHIP CAPACITORS

机译:多层陶瓷芯片电容器的预工程化电极/介电复合膜及其制造工艺

摘要

To manufacture multilayer ceramic capacitors are used shaping techniques of the electrodes and densifying the layers. The capacitors manufactured in this manner have electrodes (12) and dielectric layers (14) are uniform, while being thinner and flatter than the electrodes and the dielectric layers manufactured according to the techniques used so far. An electrode pattern is printed on a coated sheet of separation (10) and is then calendered. A dielectric layer covering the electrode pattern and is then calendered, thereby forming a green sheet on the recessed electrode. The green sheet is then stacked on other green sheets recessed electrode formed in the same manner and then the stack is laminated and crude capacitors are separated from the stack.
机译:为了制造多层陶瓷电容器,使用了电极的成形技术并使层致密。以这种方式制造的电容器具有电极(12),并且电介质层(14)是均匀的,同时比根据到目前为止使用的技术制造的电极和电介质层更薄和更平坦。将电极图案印刷在分离的涂层纸(10)上,然后压延。覆盖电极图案的电介质层然后被压延,从而在凹陷的电极上形成生片。然后将生片堆叠在以相同方式形成的其他生片凹入电极上,然后将堆叠体层压,并从堆叠体中分离出粗电容器。

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