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A process for the modification of surfaces and application of this method for the preparation of the layered structures.

机译:表面改性的方法和该方法在制备层状结构中的应用。

摘要

A silicon-modified organic surface is roughened by treatment with an oxygen containing plasma. If necessary the organic surface may be silicon- modified by treatment with a silicon containing material prior to plasma treatment. The roughened organic surface provides improved adhesion to other organic surfaces and to deposited metals. Improvements in methods for laminating organic surfaces and for depositing metals on organic surfaces which achieve improved adhesion are disclosed. Structures comprising laminated organic layers or metal deposited on organic surfaces which provide improved adhesion between the organic layers or between the metal and the organic surface are also disclosed.
机译:通过用含氧等离子体处理使硅改性的有机表面粗糙化。如果需要,可以通过在等离子体处理之前用含硅材料处理来对有机表面进行硅改性。粗糙的有机表面可提高对其他有机表面和沉积金属的附着力。公开了用于层压有机表面和在有机表面上沉积金属的方法的改进,其实现了改善的粘合性。还公开了包括层叠的有机层或沉积在有机表面上的金属的结构,其提供了有机层之间或金属和有机表面之间的改进的粘附性。

著录项

  • 公开/公告号DE3780676T2

    专利类型

  • 公开/公告日1993-03-11

    原文格式PDF

  • 申请/专利权人 IBM US;

    申请/专利号DE19873780676T

  • 发明设计人 SUSKO ROBIN ANNE US;JONES CAROL RUTH US;

    申请日1987-03-17

  • 分类号C23C18/22;

  • 国家 DE

  • 入库时间 2022-08-22 05:02:18

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