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AL-BASED MATERIAL FORMATION-DEFECT DETECTION METHOD AND AL-BASED MATERIAL FORMATION METHOD

机译:基于al的材料形成缺陷检测方法和基于al的材料形成方法

摘要

PURPOSE: To provide an At-based material formation-defect detection method wherein the formation defect (the burying defect) in the Al burying operation of an Al-based material by a high-temperature sputtering operation can be detected easily in a short time and the burying defect can be evaluated in terms of number barriers and to provide an Al-based material formation method using it. ;CONSTITUTION: In an Al-based material formation technique, an Al-based material is formed on a substratum material (Ti or the like on a substrate 1) by a high-temperature sputtering operation. In the formation technique, (A) the Al-based material is formed, the Al-based material which has been formed is then removed, and whether a reacted part and a nonreacted part 31 of the Al-based material with the substratum material exist or not is investigated. Thereby, the formation defect of the Al-based material is detected. (B) A pattern part for defect detection and observation use is formed in advance on the substratum material, the Al-based material is then formed, the Al-based material which has been formed is removed in the pattern part for defect detection and observation use and whether the reacted part and the nonreacted part of the Al-based material with the substratum material exist or not is investigated. Thereby, an Al-based material formation method detects the formation defect of the Al-based material.;COPYRIGHT: (C)1994,JPO&Japio
机译:目的:提供一种基于At的材料形成缺陷的检测方法,其中可以在短时间内容易地检测通过高温溅射操作进行的Al基材料的Al埋入操作中的形成缺陷(埋入缺陷),并且掩埋缺陷可以根据数量壁垒进行评估,并提供使用该缺陷的Al基材料形成方法。组成:在Al基材料形成技术中,Al基材料通过高温溅射操作形成在基底材料(基板1上的Ti等)上。在形成技术中,形成(A)Al基材料,然后去除已经形成的Al基材料,以及是否存在Al基材料与基质材料的反应部分和未反应部分31。是否进行调查。由此,检测出Al基材料的形成缺陷。 (B)在基底材料上预先形成用于缺陷检测和观察的图案部分,然后形成Al基材料,在用于缺陷检测和观察的图案部分中去除已形成的Al基材料。研究使用Al基材料与基质材料的反应部分和未反应部分是否存在。从而,一种基于铝的材料形成方法检测了基于铝的材料的形成缺陷。;版权所有:(C)1994,日本特许厅&日本apio

著录项

  • 公开/公告号JPH0669307A

    专利类型

  • 公开/公告日1994-03-11

    原文格式PDF

  • 申请/专利权人 SONY CORP;

    申请/专利号JP19920100337

  • 发明设计人 TAGUCHI MITSURU;

    申请日1992-03-26

  • 分类号H01L21/66;C23C14/54;H01L21/28;H01L21/3205;

  • 国家 JP

  • 入库时间 2022-08-22 04:51:48

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