首页> 外国专利> METHOD OF FORMING SEMICONDUCTOR FILM AND METHOD OF FABRICATING THIN FILM SEMICONDUCTOR DEVICE, AND METHOD OF HEAT-TREATING SUBSTRATE AND METHOD OF CHEMICAL VAPOR DEPOSITION

METHOD OF FORMING SEMICONDUCTOR FILM AND METHOD OF FABRICATING THIN FILM SEMICONDUCTOR DEVICE, AND METHOD OF HEAT-TREATING SUBSTRATE AND METHOD OF CHEMICAL VAPOR DEPOSITION

机译:形成半导体膜的方法和制造薄膜半导体器件的方法,热处理基质的方法和化学气相沉积的方法

摘要

PURPOSE: To provide a method of fabricating a thin film semiconductor device having satisfactory transistor characteristics in a low temperature process. ;CONSTITUTION: An amorphous semiconductor film is deposited, and is thereafter heat-treated in an oxidative atmosphere. Hereby, a TFT having satisfactory transistor characteristics can be fabricated uniformly into a large area in a low temperature process by a simplified method.;COPYRIGHT: (C)1995,JPO
机译:目的:提供一种在低温工艺中制造具有令人满意的晶体管特性的薄膜半导体器件的方法。 ;组成:沉积非晶半导体膜,然后在氧化气氛中进行热处理。因此,可以通过简化的方法在低温工艺中将具有令人满意的晶体管特性的TFT均匀地大面积地制造。; COPYRIGHT:(C)1995,JPO

著录项

  • 公开/公告号JPH07130668A

    专利类型

  • 公开/公告日1995-05-19

    原文格式PDF

  • 申请/专利权人 SEIKO EPSON CORP;

    申请/专利号JP19930322724

  • 发明设计人 MIYASAKA MITSUTOSHI;

    申请日1993-12-21

  • 分类号H01L21/205;H01L21/20;H01L21/324;H01L29/786;H01L21/336;

  • 国家 JP

  • 入库时间 2022-08-22 04:24:01

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