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Tin Bismuth Solder Paste, and Method Using Paste to Form Connection Having Improved High Temperature Properties
Tin Bismuth Solder Paste, and Method Using Paste to Form Connection Having Improved High Temperature Properties
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机译:锡铋锡焊膏以及使用该焊膏形成具有改善的高温性能的连接的方法
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摘要
A solder paste of the type utilized in forming a solder onnectin for a microelectronic package comprises a mixture of compositionally distinct metal powders. The paste comprises a first metal powder formed of tin-bismuth solder alloy. The paste further comprises a second metal powder containing gold or silver. During reflow, the gold or silver alloys with the tin-bismuth solder to increase the melting part and enhance mechanical properties of the product connection.
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