An electronic package that has a die coupled to a lead frame by a dielectric tape and a heat sink that providees both an electrical and a thermal path between the die and teh lead frame

摘要

An electronic package which has a heat sink that is attached to the lead frame of the package with a material that is both electrically and thermally conductive. The lead frame is also coupled to a first surface of an integrated circuit die with tape automated bonded (TAB) leads. The low thermal resistance of the heat sink increases the thermal performance of the package. The heat sink may also be mounted directly to the die with a conductive material so that the die is electrically grounded to the heat sink. The heat sink is then bonded to the leads of the lead frame that are dedicated to ground. In this embodiment, the heat sink provides the dual functions of a ground plate and a heat spreader.