Ti and the Ti alloy you attach slowly and the Ti alloy base which is suited for junction you attach slowly, material

摘要

PURPOSE:To further increase the max. tensile strength at joining part by specifying the composition range of a Ti alloy kind solder material and having various kind of characteristic in the material. CONSTITUTION:The component composition of the brazing material is shown in the molecular formula and the atomic ratio in this formula is made to =20% (a), =30% (b),= 40% (c). Further, X component is composed of at least one group among (1) group = 30% total content of one or more kinds selected from Co, Mn and Sn, (2) group = 35% total content of one or more kinds selected from Zr, Cr and V, (3) group = 10% total content of one or more kinds selected from B, Si, P and Ge and (4) group =10% total content of one or more kinds selected from Sc, Y, REM and balance inevitable impurities. The brazing material is made to form of ribon or wire after rapidly cooling and solidifying molten metal having the above composition. Therefore, the brazing material having good tensile strength at joint part and preventing development of smoke and improving workability of brazing, is obtd at low cost.