首页> 外国专利> ATOMIC ABSORPTION ANALYSIS FOR MEASURING AND CONTROLLING THE AMOUNT OF A METAL VAPOR IN VAPOR DEPOSITION COATING LINE AND APPARATUS THEREFOR

ATOMIC ABSORPTION ANALYSIS FOR MEASURING AND CONTROLLING THE AMOUNT OF A METAL VAPOR IN VAPOR DEPOSITION COATING LINE AND APPARATUS THEREFOR

机译:气相沉积镀膜线及其装置中金属蒸气量的测量与原子吸收分析

摘要

A metal vapor 12 passing through a guide duct 13 from a vapor source 10 to a steelstrip 1 is sampled through a takeoff pipe 14 to a measuring chamber 15. The metal vapor isirradiated with a measuring beam 20 in the chamber 15, to detect the absorbance of luminousenergy in the metal vapor. The detected value of absorbance is used for the quantitativecalculation of the metal vapor 12 passing through the guide duct 13, and the opening ratio of ashutter 17provided in the guide duct 13 is adjusted on the basis of the calculation result so asto control the flow amount of the metal vapor 12 passing through the guide duct 13. In thecase where a large amount of the metal vapor 12 passes through the guide duct 13, theamount of the metal vapor 12 reaching the measuring beam 20 is reduced by partiallydischarging the metal vapor 12 from the measuring chamber 15. Since the deposition amountof a plating metal is directly controlled in response to the amount of the metal vapor12passing through the guide duct 13, the amount of a deposited plating layer is controlled withhigh accuracy and with a quick response time in a continuous vapor deposition coating line.
机译:金属蒸气12从气体源10穿过导管13到达钢通过出口管14将钢带1取样到测量室15。在腔室15中用测量光束20照射,以检测发光的吸收率金属蒸气中的能量。吸光度的检测值用于定量导管13中通过的金属蒸气12的计算以及开孔率基于计算结果来调节在导管13中提供的百叶窗17,使得从而控制通过导管13的金属蒸气12的流量。在大量金属蒸气12通过导管13的情况下,到达测量光束20的金属蒸气12的量减少了一部分从测量室15中排出金属蒸气12。由于沉积量根据金属蒸气的量直接控制电镀金属的含量12通过导管13,沉积的镀层的数量由在连续的气相沉积涂装生产线中具有很高的精度和响应时间。

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