PROBE SUBSTRATE FOR BARE-CHIP INSPECTION AND ITS MANUFACTURE AS WELL AS BARE-CHIP INSPECTION SYSTEM

摘要

PROBLEM TO BE SOLVED: To perform a fine alignment operation by a method wherein, simultaneously with the formation of a protrusion on a wiring pattern on a substrate, a mark, for alignment, which can be confirmed from the outside is formed on the substrate in a position which is deviated from a position faced with an aluminum pad. ;SOLUTION: In a probe substrate for inspection, a wiring pattern 2a is executed to the substrate 1, and a protrusion 7 is formed on the wiring pattern 2a so as to be brought into contact with an aluminum pad at a bare chip to be inspected. In addition, simultaneously with the formation of the protrusion 7, a mark 8, for alignment, which can be confirmed from the outside is formed on the substrate 1 in a position which is deviated from a position faced with the aluminum pad. Thereby, even when the alignment of the aluminum pad at the bare chip, to be inspected, with the protrusion cannot be confirmed directly, the mark 8 is confirmed from the outside, their dislocation is corrected immediately before the aluminum pad is brought into contact with the protrusion 7, and a fine alignment operation can be performed.;COPYRIGHT: (C)1998,JPO