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Taping lead/read frame

机译:编带/读框

摘要

PROBLEM TO BE SOLVED: To prevent short-circuit due to metal ion migration which is to be generated between adjacent leads. ;SOLUTION: A part of a region of adhesive agent spread on an insulating tape 2 stuck on a taping lead frame 1 is eliminated, and migration of metal ions which is generated by the generation of an electric field between leads is intercepted. A region of the adhesive agent whose shape intercepts the migration path of metal ions can be formed, by applying the following shapes; a zigzag shape wherein a part of a straight line which connects, at the shortest distance, the leads generating the electric field is removed, or a shape wherein slits are formed in a wavey type or a zigzag type.;COPYRIGHT: (C)1997,JPO
机译:要解决的问题:为了防止由于相邻引线之间产生的金属离子迁移而引起的短路。 ;解决方案:消除了在粘在带状引线框架1上的绝缘带2上扩散的一部分粘合剂区域,并拦截了由于引线之间产生电场而产生的金属离子迁移。通过施加以下形状,可以形成形状与金属离子的迁移路径交叉的粘合剂区域。曲折形状,其中以最短距离连接产生电场的引线的直线的一部分被去除,或者形状为波浪形或锯齿形形成狭缝的形状.COPYRIGHT:(C)1997 ,日本特许厅

著录项

  • 公开/公告号JP2758873B2

    专利类型

  • 公开/公告日1998-05-28

    原文格式PDF

  • 申请/专利权人 KYUSHU NIPPON DENKI KK;

    申请/专利号JP19950305359

  • 发明设计人 MATSUTOMO MITSUHIRO;

    申请日1995-11-24

  • 分类号H01L23/50;

  • 国家 JP

  • 入库时间 2022-08-22 03:00:47

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