METHOD OF BONDING TOGETHER SUBSTRATE AND ELEMENT STRUCTURE FOR SAID METHOD

摘要

PROBLEM TO BE SOLVED: To provide a method of bonding together substrates, which divides bonding parts for bonding together the substrates into bonding parts for securing the mechanical bonding strength of the substrates and functional bonding parts for attaining the functional bonding of the substrates to bond together the substrates, and to make it possible to bond together the substrates in such a way. ;SOLUTION: A bonding force is given to substrates 1 and 9 and the substrate 1 and a substrate 16 by bonding together members 5 and 13 and members 8 and 21, which have a plastic deformability. By this bonding force, functional bonding parts 2 and 11 of the substrates 1 and 9 are made to closely adhere to each other, and a functional bonding such as an electrical bonding and an optical bonding is achieved between the substrates 1 and 9 and the substrates 1 and 16.;COPYRIGHT: (C)1999,JPO