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Growth manner null of compound semiconductor

机译:化合物半导体的生长方式无效

摘要

PURPOSE:To drastically enhance the crystallization yield of single crystal by immersing seed crystal in the melt of a raw material and thereafter slowly lowering the temp. of the melt by the specified conditions, and growing single crystal to a necessary shape and then starting pulling-up thereof. CONSTITUTION:A crucible 4 is provided to the inside of a high-pressure vessel 1 filled with inert gas 9 and holds both melt 13 for a raw material of a compound semiconductor and a liquid sealer 12 for covering the top face of this melt 13. After seed crystal 10 of the compound semiconductor is brought into contact with the top face of the melt 13, the seed crystal 10 is pulled up to the upper part. Thereby, single crystal is grown by slowly coagulating the melt 13. The following means are adopted in the above-mentioned method. In other words, after the seed crystal 10 is attached to the top face of the melt 13, the temp. thereof is lowered by 6-12 deg.C and crystal is grown on the seed crystal 10. Firstly, rotation of the crucible 4 is gradually increased without pulling up the seed crystal 10. The temp. in the center part of the melt 13 is lowered. After elapse of 0.5-2 minutes, furthermore, the temp. of the melt is slowly lowered at the lowering rate of -0.21 to-$0.88 deg.C/minute and crystal is grown in the lateral direction. At a point of time when crystal reaches a prescribed shape, the seed crystal 10 is pulled up at the specified pulling-up velocity.
机译:目的:通过将晶种浸入原料熔体中,然后缓慢降低温度,以大大提高单晶的结晶产率。在规定条件下熔融,然后将单晶生长成所需的形状,然后开始提拉。组成:在装有惰性气体9的高压容器1的内部装有坩埚4,坩埚4容纳着化合物半导体原料的熔​​体13和覆盖该熔体13顶面的液体密封剂12。在化合物半导体的籽晶10与熔体13的顶面接触之后,将籽晶10上拉至上部。从而,通过使熔体13缓慢凝结来生长单晶。在上述方法中采用以下手段。换句话说,在将籽晶10附着到熔体13的顶面之后,温度变为0。将其温度降低6-12℃,并在种晶10上生长晶体。首先,在不提起种晶10的情况下,逐渐增加坩埚4的旋转。熔体13的中央部分的温度降低。经过0.5-2分钟后,温度会升高。以-0.21至-0.88℃/分钟的降低速率缓慢降低熔体的熔点,并且晶体沿横向生长。在晶体达到规定形状的时间点,以规定的提起速度提起籽晶10。

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