semiconductor chip and semiconductor chip issues extensive method

摘要

the invention of semiconductor wafer, and semiconductor wafer cutting machine in the hand to buy, difficult to semiconductor wafer and its manufacturing method, to provide for the purpose. the cutting of the wafer (20), the upper light emission. the risk of live line (broken line) (24) than the width of the groove (26) in the truncated form. it is to be cut (22) of the ring (28) for cutting the web (26) of the side wall (32) has a section (30) in the dry state. therefore, the light emission (city province) are used for the cutting groove (26) of the wafer (20) to cut off the light emission, and have cut the groove (26) of the side wall (32) up to the possibility is very low. therefore, the light emission time in the friendship of the die (22) to prevent the damage of the above.