A process for restoring a wafer determined to be defective in a line so that it can be used as a new wafer

摘要

The process of the present invention can be used to restore a defective or rejected semiconductor wafer to a defect-free form, using an etchant and a modified Smart-Cut (TM) process. Since the modification process of the Smart-Cut (registered trademark) process is used, the diffusion region is removed without significantly affecting the specifications of the semiconductor wafer. Therefore, defective or rejected wafers can be restored to their original state for use in semiconductor manufacturing.