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Metal deposition onto a substrate surface with a recess especially a sub-micron size via in semiconductor device production
Metal deposition onto a substrate surface with a recess especially a sub-micron size via in semiconductor device production
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机译:在半导体器件生产中,将金属沉积到具有凹槽(尤其是亚微米尺寸的通孔)的基板表面上
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摘要
Metal is deposited onto a substrate surface including a recess (5) at a deposition temperature and rate such that metal deposits on the recess bottom (20) but not on the side walls (25).
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