A circuit board testing device with a plurality of contact points (4) arranged in the plane of the contact field (2) of the device, which are connected to an electronic drive and measuring device and can be connected via test pins (6), which are rigid in the longitudinal direction, to the contact points of the wiring carriers/circuit boards (8) to be tested, the contact points being elastically supported in the circuit board testing device and are pressed against the contact pressure to be applied, the contact points (4) being constructed as electrically conductive compression springs (28) which are arranged in holes (25) of a spring contact field body (26) of electrically insulating material and against which the rigid test pins (6) are directly pressed. The invention provides that the spring contact field body (26) is constructed of segments which can be joined together in a row and that areas of different density of connection of contact points (4) exist in the contact field plane (2), the areas being mutually interchangeable depending on the requirements of the circuit board (8) to be tested. IMAGE
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