APPLYING AND DEVELOPING APPARATUS AND SUBSTRATE RECYCLING SYSTEM IN APPLYING AND DEVELOPING PROCESS

摘要

PROBLEM TO BE SOLVED: To realize an applying and developing apparatus which can improve throughput and cope with automation, when it is put in operation to check a processed substrate or a monitoring substrate. ;SOLUTION: A pattern check section 4, which checks a resist pattern and a carrier that houses wafers which are rejected by inspection are provided to the transfer region of a wafer transfer section which loads or unloads a carrier placed on a carrier loading/unloading section, the carrier is transferred to a cleaning station provided outside an apparatus, the resist is removed from a rejected wafer by cleaning for recycling the rejected wafer, and the rejected wafer is reloaded into the apparatus. The thickness of a resist film formed on a monitoring wafer is measured at a film thickness measuring part 50 provided inside the apparatus, and then the resist film is removed from the monitoring wafer by the use of a solvent nozzle for recycling the monitoring wafer.;COPYRIGHT: (C)2000,JPO