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ALIGNMENT METHOD AND OVERLAY MEASURING METHOD IN LITHOGRAPHY PROCESS, ALIGNER, AND OVERLAY MEASURING INSTRUMENT
ALIGNMENT METHOD AND OVERLAY MEASURING METHOD IN LITHOGRAPHY PROCESS, ALIGNER, AND OVERLAY MEASURING INSTRUMENT
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机译:光刻过程中的对准方法和叠加测量方法,测斜仪和叠加测量仪器
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摘要
PROBLEM TO BE SOLVED: To make abnormal data removable with high accuracy by finding the medium value of a plurality of residual data, and removing measured data corresponding to the residual data which exceed a preset allowable value as abnormal data on the basis of the medium value.;SOLUTION: When an aligner makes alignment, the positional deviated amounts of alignment marks formed on a wafer from prescribed positions are measured (ST1). Then alignment correcting amounts are found (ST2), and a plurality of residual data are obtained by removing the linear error components of the wafer from each obtained measured data (ST3). After obtaining the residual data, the medium value of the data is found (ST4) and whether the residual data exceed a preset allowable value is discriminated on the basis of the medium value and the residual data exceeding the allowable value are decided as being abnormal data (ST6). Finally, the measured data corresponding to the residual data which were discriminated as being abnormal data are removed from stored measured data (ST7).;COPYRIGHT: (C)2000,JPO
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