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Connection method null of circuit conductor mutual joint body and circuit

机译:电路导体相互接头体与电路的连接方法无效

摘要

PURPOSE: To establish a method of connecting circuit conductors on a circuit board with another conductor effectively by putting the conductors one over the other, and attaching a small piece of thermoplastic resin onto the overlapping parts by means of fusion attachment. ;CONSTITUTION: A conductor to be connected 3 consisting of a conductive metal plate is laid in the specified positions on circuit conductors 2, 2'. In these overlapping parts 4, 4', the conductor 3 and the circuit conductors 2, 2' are connected together electrically. Cylindrical small pieces 5, 5' made of a thermoplastic resin, the same material as the circuit board, are laid on the overlapping parts 4, 4', and an ultrasonic processing is applied from above the small pieces 5, 5'. The diameter of the small pieces 5, 5' should be as enclosing the overlapping parts 4, 4' sufficiently. The small pieces 5, 5' on the parts 4, 4' are heated and melted ultrasonically, and the circuit board 1 under the pieces 5, 5' is also melted to generate fusion attachment with one another, and also the circuit conductors 2, 2' surrounded by the pieces 5, 5' and the conductor 3 are put in tight attachment and contacting with each other.;COPYRIGHT: (C)1996,JPO
机译:用途:建立一种方法,可以通过以下方式有效地将电路板上的电路导体与另一导体连接:将导体彼此叠置,然后通过熔接将一小块热塑性树脂粘合到重叠的部分上。 ;组成:要连接的由导电金属板组成的导体3放置在电路导体2、2'上的指定位置。在这些重叠部分4、4'中,导体3和电路导体2、2'电连接在一起。由与电路板相同材料的热塑性树脂制成的圆柱形小块5、5'放置在重叠部分4、4'上,并且从小块5、5'上方进行超声处理。小块5、5'的直径应尽可能地包围重叠部分4、4'。零件4、4'上的小块5、5'被超声加热和熔化,并且在小块5、5'下面的电路板1也被熔化以彼此产生熔合,并且电路导体2也被熔化。紧贴着由零件5、5'包围的2'和导体3并使其相互接触。;版权所有:(C)1996,日本特许厅

著录项

  • 公开/公告号JP2991324B2

    专利类型

  • 公开/公告日1999-12-20

    原文格式PDF

  • 申请/专利权人 YAZAKI SOGYO KK;

    申请/专利号JP19940242750

  • 发明设计人 MAEJIMA MOTOFUMI;

    申请日1994-10-06

  • 分类号H01R4/58;H01R11/01;H01R43/02;

  • 国家 JP

  • 入库时间 2022-08-22 01:57:58

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