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Structures of a low-voltage-operative non-volatile ferroelectric memory device with floating gate

机译:具有浮栅的低压操作非易失性铁电存储器件的结构

摘要

A non-volatile ferroelectric memory device has been developed, in which the lead titanate (PbTiO.sub.3) thin film is deposited on a n/P. sup.+ Si substrate by rf magnetron sputtering as the gate oxide and Pt is embedded in the gate oxide as the floating gate. Additionally, associated with the rapid bulk channel structure with higher mobility, the developed memory device has the following features: (1) low write/erase voltage (. ltoreq.10 V); (2) fast access time ( 160 ns); (3) easy to fabricate on VLSI memory device.
机译:已经开发出一种非易失性铁电存储器件,其中钛酸铅(PbTiO.sub.3)薄膜沉积在n / P上。 sup +硅衬底通过射频磁控溅射作为栅氧化物,而Pt嵌入在栅氧化物中作为浮栅。另外,与具有更高迁移率的快速体通道结构相关联,开发的存储器件具有以下特征:(1)低的写入/擦除电压(≤10V); (2)快速访问时间(<160 ns); (3)易于在VLSI存储设备上制造。

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