FANOUT-TYPE MICRO BALL GRID ARRAY SUBSTRATE AND METHOD FOR MANUFACTURING FANOUT-TYPE MICRO BALL GRID ARRAY

摘要

PURPOSE: A method for manufacturing a fanout-type micro ball grid array(BGA) is provided to fabricate the micro BGA package regardless of a location of a chip pad, and to make the same micro BGA package by using the same cover film regardless of a size of the chip pad. CONSTITUTION: A wafer is sawed into individual chips. The individual chip is mounted on a substrate. A chip pad located in an outer wall of an upper surface of the chip mounted on the substrate is connected to a copper lead. After the chip pad is connected to the copper lead, the copper lead and the outside of the chip are sealed by encapsulant. A cover film is adhered. A solder ball is mounted on tape. An unnecessary part is eliminated.