首页> 外国专利> SILICON NITRIDE THIN FILM INCLUDING AMORPHOUS SILICON QUANTUM DOT FINE STRUCTURE AND MANUFACTURING METHOD THEREOF

SILICON NITRIDE THIN FILM INCLUDING AMORPHOUS SILICON QUANTUM DOT FINE STRUCTURE AND MANUFACTURING METHOD THEREOF

机译:包括非晶硅量子点精细结构的氮化硅薄膜及其制造方法

摘要

PURPOSE: A silicon nitride thin film and a method for fabricating the same are provided to increase a luminous efficacy and to form a silicon fine structure having a good short wavelength luminous efficacy. CONSTITUTION: An amorphous silicon quantum dot fine structure is grown on a n-type silicon substrate by a PECVD method, using a nitride gas of 99.999% and a silane gas of 5% diluted in a nitride gas, thereby obtain a silicon thin film. The amorphous silicon quantum dot fine structure is scattered within a silicon nitride matrix. A flux of the silane gas is 10 sccm, the growth pressure is 0.5 Torr, and a plasma power is 6W. The growth temperature 100 to 300 deg.C, and a flux of the nitride gas is 500 to 800 sccm. The growth rate is 2.6 to 3.2 nm/minute according to the flux of the nitride gas. Consequently, the amorphous silicon quantum dot fine structure obtains a high luminous efficiency without performing a thermal treatment, and controls a color of a light radiated according to the flux of the nitride gas.
机译:目的:提供氮化硅薄膜及其制造方法以增加发光效率并形成具有良好的短波长发光效率的硅精细结构。组成:非晶态硅量子点精细结构是通过PECVD方法在n型硅衬底上生长的,使用的氮化物气体浓度为99.999%,稀释的硅烷气体浓度为5%,从而获得硅薄膜。非晶硅量子点精细结构散布在氮化硅基质内。硅烷气体的通量为10sccm,生长压力为0.5Torr,等离子功率为6W。生长温度为100至300℃,并且氮化物气体的通量为500至800sccm。根据氮化物气体的通量,生长速率为2.6至3.2nm /分钟。因此,非晶硅量子点精细结构在不执行热处理的情况下获得了高发光效率,并且根据氮化物气体的通量来控制辐射的光的颜色。

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