PURPOSE: To prevent the problems of a package and crack by improving oxide adhesion of copper alloy which is used for a lead frame of a resin sealed semiconductor package. CONSTITUTION: The copper alloy has a {100} peak intensity ratio less than 0.04 against {111} peak intensity of the copper alloy crystal which consists of top layer. The top layer is of base metal of the copper alloy lead frame that is evaluated by XRD thin film law.
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