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Polymer Optical Fiber Array and Package Structure for Planar Optical Circuit Device Connection

机译:用于平面光电路设备连接的聚合物光纤阵列和封装结构

摘要

Disclosed are a polymer optical fiber array and a polymer package structure useful for low-cost, high-reliability connection technology of multi-channel planar optical circuit devices, which are expected to be increased in the future for the transfer of a large amount of information required in an information society. The present invention uses an optical fiber array molded of a polymer material as a component for connecting multiple optical fibers for low cost and high reliability of a planar optical circuit device. The optical fiber array can be made at once by molding, and the holes in which the optical fiber is located can be formed with high precision during molding. When the optical fiber array is formed of polymer resin, the end of the optical fiber does not require many components for fixing, and the level of ultra precision processing technique required is low, and is suitable for mass production. The optical fiber array is made of a polymer composite material made of fused silica filled with a thermosetting epoxy resin in consideration of mechanical strength and dimensional stability, and a snap joint using an elastic body for simple and reliable connection of planar optical circuit devices. ) Use a coupling structure.
机译:公开了一种用于多通道平面光电路装置的低成本,高可靠性连接技术的聚合物光纤阵列和聚合物封装结构,预计在将来为传送大量信息而将增加该聚合物光纤阵列和聚合物封装结构。在信息社会中是必需的。本发明使用由聚合物材料模制的光纤阵列作为用于连接多根光纤的部件,以降低平面光电路装置的成本和高可靠性。可以通过模制一次制造光纤阵列,并且可以在模制期间高精度地形成光纤所位于的孔。当光纤阵列由聚合物树脂形成时,光纤的端部不需要用于固定的许多部件,并且所需的超精密加工技术的水平低,并且适合于批量生产。考虑到机械强度和尺寸稳定性,光纤阵列由填充有热固性环氧树脂的,由熔融石英制成的聚合物复合材料,以及利用弹性体的卡扣接头制成,以简单可靠地连接平面光电路装置。 )使用耦合结构。

著录项

  • 公开/公告号KR100301707B1

    专利类型

  • 公开/公告日2001-10-29

    原文格式PDF

  • 申请/专利权人 한국전자통신연구원;

    申请/专利号KR19980051087

  • 发明设计人 정명영;안승호;최상국;

    申请日1998-11-26

  • 分类号G02B6/00;

  • 国家 KR

  • 入库时间 2022-08-22 01:12:06

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