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Integrated semiconductor circuit has n-type independent resistance layer and p-type resistance layer, between which PN junction is formed during reverse bias condition
Integrated semiconductor circuit has n-type independent resistance layer and p-type resistance layer, between which PN junction is formed during reverse bias condition
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机译:集成半导体电路具有n型独立电阻层和p型电阻层,在反向偏置条件下在它们之间形成PN结
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摘要
An n-type independent resistance layer (4N) is formed in preset area of substrate. A p-type resistance layer (6) is formed in preset area of the layer (4N). A n+ type wall layer (7) surrounds sides of the layer (4N). Impurity concentration of the wall layer is higher than that of layer (4N). Voltage (Vcc) is supplied to the wall layer and PN junction is formed between the layers (4N,6) during reverse bias condition. A power supply is connected with destroyable Zener diode through resistors and the diode is formed on substrate (2). An Independent claim is also included for Zener diode destruction method.
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机译:在基板的预设区域中形成n型独立电阻层(4N)。在层(4N)的预定区域中形成p型电阻层(6)。 n +型壁层(7)围绕层(4N)的侧面。壁层的杂质浓度高于层(4N)的杂质浓度。在反向偏压条件下,将电压(Vcc)提供给壁层,并在各层(4N,6)之间形成PN结。电源通过电阻器与可破坏的齐纳二极管相连,并且该二极管形成在基板(2)上。齐纳二极管销毁方法也包括独立索赔。
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