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Non destructive ultra-sound test method for detecting internal faults in cathodic pulverized targets to be deposited on substrate of integrated circuit, determines real fault inclusion
Non destructive ultra-sound test method for detecting internal faults in cathodic pulverized targets to be deposited on substrate of integrated circuit, determines real fault inclusion
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机译:用于检测要沉积在集成电路基板上的阴极粉碎目标内部故障的无损超声测试方法,确定实际故障包括
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摘要
The method has the following stages: (a) the dimension of the real internal fault is determined in a pulverization target material by sweeping it with ultrasound and recording the amplitude of the generated signal; (b) a metallurgical measurement is made of the internal fault dimension by exposing it; (c) the measurement is correlated with the metallurgical measurement to obtain a correlation factor for the material of the target, the factor when multiplied by future ultrasound measurement for a fault gives the real dimension of the fault.
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