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Process for forming polymer thick film resistors and metal thin film resistors on a printed circuit substrate
Process for forming polymer thick film resistors and metal thin film resistors on a printed circuit substrate
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机译:在印刷电路基板上形成聚合物厚膜电阻器和金属薄膜电阻器的方法
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摘要
A process is disclosed for forming resistors on a printed circuit substrate. The method includes the step of applying a photoresist layer onto substrate, and forming openings in the photoresist layer to expose the preselected regions for resistors, such that polymer thick resist pastes as well as resistive metallic films can be applied onto the substrate through these openings with precise geometry. The process according to the invention has higher accuracy and greater processing flexibility than the prior art processes where the resistor pastes are directly applied onto the substrate by screen printing.
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