首页> 外国专利> DOUBLE-HEAD SURFACE GRINDING DEVICE WITH WASHING DEVICE FOR GRINDING WHEEL AND WASHING METHOD FOR THE GRINDING WHEEL

DOUBLE-HEAD SURFACE GRINDING DEVICE WITH WASHING DEVICE FOR GRINDING WHEEL AND WASHING METHOD FOR THE GRINDING WHEEL

机译:带有用于研磨轮的洗涤装置的双头表面研磨装置以及用于研磨轮的洗涤方法

摘要

PROBLEM TO BE SOLVED: To prevent the lowering of grinding efficiency and precision by preventing the deterioration in cutting sharpness of a rotary grinding wheel caused by loading generated in the rotary grinding wheel and prevent the warp etc., of a wafer caused by the lowering of the grinding precision by eliminating the difference in the cutting sharpness in upper/lower rotary grinding wheels.;SOLUTION: This double-head surface grinding device is provided with the lower rotary grinding wheel 15 and an upper rotary grinding wheel 16. The grinding operation surface of the grinding portion 15A in the lower rotary grinding wheel 15 and the grinding operation surface of a grinding portion 16A in the upper rotary grinding wheel 16 are parallel to each other. This grinding devise is provided with a nozzle 60 for washing the grinding wheel portions 15A and 16A by spraying high-pressure washing liquid after completing the grinding work.;COPYRIGHT: (C)2002,JPO
机译:解决的问题:通过防止旋转磨轮中产生的载荷引起的旋转磨轮的切削锋利度的降低来防止磨削效率和精度的降低,并且防止由降低的磨削引起的晶片的翘曲等。通过消除上/下旋转砂轮的切削锋利差异来提高研磨精度。解决方案:此双头平面磨削装置配有下旋转砂轮15和上旋转砂轮16。下旋转砂轮15中的研磨部分15A的磨削面与上旋转砂轮16中的研磨部分16A的磨削操作面彼此平行。该研磨装置设置有喷嘴60,该喷嘴60用于在完成研磨工作之后通过喷射高压清洗液来清洗研磨轮部分15A和16A。版权所有:(C)2002,JPO

著录项

  • 公开/公告号JP2002178258A

    专利类型

  • 公开/公告日2002-06-25

    原文格式PDF

  • 申请/专利权人 NIPPEI TOYAMA CORP;

    申请/专利号JP20000379840

  • 申请日2000-12-14

  • 分类号B24B53/007;B24B7/17;B24B55/06;

  • 国家 JP

  • 入库时间 2022-08-22 00:57:21

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