PEELING SOLUTION FOR PEELING LEAD-FREE ALLOY ON NICKEL OR IRON-NICKEL ALLOY

摘要

PROBLEM TO BE SOLVED: To provide a peeling solution in which a lead-free tin alloy layer on a nickel or an iron-nickel alloy substrate as and a nickel (iron nickel alloy)-tin alloy under layer can be peeled so that the dissolution of the substrate is low suppressed as possible, and the surface after the peeling treatment is, and further, replating can stably be performed on to the smooth or substrate after the peeling.;SOLUTION: As this peeling solution, an aqueous solution at least containing alkanesulfonic acid in the range of 35 to 420 mL/L, containing (meta) nitrobenzenesulfonic acid or the salt thereof in the range of 10 to 300 g/L and further containing one or more kinds selected from the groups consisting of thiourea, alkylthiourea and aromatic thiourea in the range of the solubility of ≥5 g/L is used, and the peeling of a tin-copper alloy as a lead-free tin alloy is made possible.;COPYRIGHT: (C)2001,JPO