Electronic circuit device and hybrid integrated circuit with an asic and an FPGA

摘要

An improved hybrid integrated circuit is provided in order that the specification can quickly be modified and adjusted when required without need for preparing a new mask and without need for compromising the performance of the hybrid integrated circuit. The hybrid integrated circuit comprises: a common substrate on which an electrode pattern is formed; a first monolithic semiconductor chip designed by the use of an ASIC technology and mounted on the common substrate; a second monolithic semiconductor chip designed by the use of an FPGA technology and mounted on the common substrate; and external terminals provided for the common substrate; and an insulating material encapsulating the first monolithic semiconductor chip and the second monolithic semiconductor chip, wherein the second monolithic semiconductor chip is provided with a storage element which is rewritable by means of a control signal given through the external terminal in order to store circuit configuration data with which internal connections of the second monolithic semiconductor chip are modified to form a hardware configuration within the second monolithic semiconductor chip corresponding to a predetermined operational specification, and wherein the first monolithic semiconductor chip and the second monolithic semiconductor chip cooperate with each other by exchanging signals through the electrode pattern of the common substrate in order to implement the predetermined operational specification.