首页> 外国专利> Dual orientation leveling platform for semiconductor apparatus

Dual orientation leveling platform for semiconductor apparatus

机译:用于半导体装置的双向取向校平平台

摘要

A platform is held atop a vertically moveable dual position leveling base by three draw screws, three push screws, and three spring-loaded pins. The leveling base is configured to secure and orient the platform such that an upper surface of the platform is substantially horizontal with allowance for adjustments in each of two positions. The platform is pushed upwardly relative to the base by the spring-loaded pins. The orientation of the platform in one position is adjusted by the three draw screws, which pull the platform down against the upward force of the spring-loaded pins. The base also has an upper position in which the platform is pressed into sealing engagement with a lower mating surface of a chamber. Three adjustable push screws provide the desired platform orientation by limiting the movement of the platform towards the base.
机译:一个平台通过三个拉紧螺钉,三个推动螺钉和三个弹簧加载销钉固定在可垂直移动的双位置调平基座上。调平基座被配置为固定和定向平台,使得平台的上表面基本水平,并允许在两个位置的每一个中进行调节。弹簧销将平台相对于基座向上推。平台在一个位置的方向通过三个拉紧螺丝进行调节,这些螺丝将平台抵抗弹簧加载销的向上力向下拉。基座还具有上部位置,在该上部位置中,平台被按压成与腔室的下部配合表面密封接合。三个可调节的推力螺钉通过限制平台向底座的移动来提供所需的平台方向。

著录项

  • 公开/公告号US6394440B1

    专利类型

  • 公开/公告日2002-05-28

    原文格式PDF

  • 申请/专利权人 ASM AMERICA INC.;

    申请/专利号US20000624127

  • 发明设计人 JACK D. CARRELL;DENNIS L. GOODWIN;

    申请日2000-07-24

  • 分类号B23Q30/00;

  • 国家 US

  • 入库时间 2022-08-22 00:48:23

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号