Semiconductor device production method thereof and coil spring cutting jig and coil spring guiding jig applied thereto

摘要

PURPOSE: To provide a semiconductor device having a flip-chip structure of high connection reliability in which occurrence of incomplete connection due to difference of thermal expansion between a functional element device and a circuit device can be prevented, a connection body of a circuit board and a functional element device rejected in electrical inspection after temporary connection can be reconnected easily after separated temporarily, and low thermal resistance can be ensured even when a large power consuming function element device having simple structure and a low package cost is used, to provide its manufacturing method, and a coil spring cutting jig and a coil spring feed jig for use therein. CONSTITUTION: A metal layer 3 is provided on the surface layer of the surface circuit board electrode 5 of a circuit board 6, a metal layer 3 is provided on the surface layer of the chip electrode 2 of a function element chip 1, a vertical coil spring 4 is connected with the surface circuit board electrode 5 and the chip electrode 2 through respective metal layers 3, and the surface circuit board electrode 5 is flip-chip connected with the chip electrode 2 through the vertical coil spring 4.