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Pressure contact arrangement, is designed for uniform pressure distribution when holding electronic component between contact surfaces

机译:压力接触装置,设计用于在将电子元件固定在接触面之间时实现均匀的压力分布

摘要

The pressure contact units (11, 12) are designed to produce an essentially symmetrical, uniform and/or homogeneous pressure distribution in the electronic component (20). This is especially so, in the regions (21a, 22a) between the contact surfaces (21, 22).
机译:压力接触单元(11、12)被设计成在电子部件(20)中产生基本对称,均匀和/或均匀的压力分布。在接触表面(21、22)之间的区域(21a,22a)中尤其如此。

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