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Mirror, used in lasers and in devices for processing workpieces, comprises a mirror body consisting of connecting layers, and a cooling structure within the layers with connections for introducing and removing a cooling medium
Mirror, used in lasers and in devices for processing workpieces, comprises a mirror body consisting of connecting layers, and a cooling structure within the layers with connections for introducing and removing a cooling medium
Mirror comprises a mirror body forming a mirror surface and consisting of connecting layers (4-6), and a cooling structure (7) within the layers with connections (18) for introducing and removing a cooling medium. An intermediate layer (5) is connected directly to the first layer (4) and is made from a material with a reduced heat expansion coefficient of not more than 10 x 10-6 (1/K). The intermediate layer is connected to the surface side facing away from the mirror surface. Preferably the material with the reduced heat expansion coefficient is an aluminum oxide, an aluminum nitride or a silicon carbide ceramic. The intermediate layer is also made from a material with a reduced heat expansion coefficient of not more than 10 x 10-6 (1/K) and is copper-silicon carbide or aluminum-silicon carbide. The intermediate layer has a thickness of 0.2-5 mm. The layers are connected together using a direct copper bonding process or by active soldering.
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