Multi-chip memory device for notebook computer, has several IC chips in common package whose control signal pads are connected to external terminals individually

摘要

A group of integrated circuit (IC) chips (12-1 - 12-4,22-1 - 22-4) are mounted in an encapsulated common package. The control signal pads of each chip are connected with external terminals individually through internal connector. Independent claims are included for the following: (1) Memory module; Multi-chip memory control method; and (2) Memory module control method.