PROBLEM TO BE SOLVED: To provide a method for optimizing chemical and mechanical flattening for a wafer having a removal layer and a stopper layer. ;SOLUTION: A slurry is added to a grinding table including a grinding pad rotatable adequately and a platen and fitted to an interface between the grinding pad and a wafer. An gas sample is extracted continuously from the slurry and fed to the inside of a reactive product detecting device. The gas sample includes a reactive product generated when the grinding pad is engaged with a stopper layer. A first time corresponding to the first detection of the reactive product in the slurry is determined, and it is defined as a first reference point. A second time corresponding to the detection of the maximum volume of the reactive product in the slurry is determined, and it is defined as a second reference point. A signal calculated from the first and second points is obtained. The signal shows the uniformity in removal of the reactive product.;COPYRIGHT: (C)2001,JPO
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