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Method for bonding and debonding films using a high-temperature polymer
Method for bonding and debonding films using a high-temperature polymer
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机译:使用高温聚合物粘合和脱粘薄膜的方法
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摘要
The invention relates to a semiconductor structure that is formed by delaminating a semiconductor substrate and by bonding the top section of the substrate to a transfer substrate. Delaminating is carried out by causing a polymer film to achieve greater adhesion that an embrittlement layer in the semiconductor substrate.
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