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Process for forming a polymer layer with a uniform thickness on the surface of a solid support, solid support obtained and its applications

机译:在固体载体表面上形成厚度均匀的聚合物层的方法,获得的固体载体及其应用

摘要

The present invention relates to a process for forming a polymer layer with a uniform thickness on the surface of a solid support, to the solid support obtained using this process, and to its applications.
机译:本发明涉及在固体载体表面上形成具有均匀厚度的聚合物层的方法,涉及用该方法获得的固体载体及其应用。

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