Procedure for structural verification of analogue integrated circuits based on the internal and concurrent observation of temperature

摘要

Procedure for structural verification of analogue integrated circuits based on the internal and concurrent observation of temperature. Procedure for detecting structural anomalies in analogue integrated circuits (2) consistent in the dynamic measurement (in time) of the temperature at various points (3, 4) of the surface of the semiconductor glass (1), carried out using temperature sensor circuits (5) integrated into the glass itself (1) of the circuit (2) being verified. The information from these sensors (6) is used to discriminate the defective circuits and its possible diagnosis and/or correction.IMAGE