首页> 外国专利> HIGH PERFORMANCE COOLING DEVICE WITH SIDE MOUNT FAN

HIGH PERFORMANCE COOLING DEVICE WITH SIDE MOUNT FAN

机译:带有侧挂式风扇的高性能冷却装置

摘要

PROBLEM TO BE SOLVED: To provide a high performance cooling device including a heat mass with at least one surface provided with as many fins as possible so as to maximize a surface area which can be used for removing wasteful heat.;SOLUTION: A side flow cooling device 10 thermally connected with a component comprises the heat mass 20; an arm 19 extending outward in contact with the heat mass 20; a wing 23 connected with a rib 21 extending downward from the arm and extending outward therefrom; and a plurality of fins 30 which are nearly aligned with a longitudinal axis of the heat mass and connected with an upper face of the heat mass and upper and lower faces of the arm. End edges facing each other which form a first and second side faces 2 and 4 of the side flow cooling device are included, and a slot is formed between the fins with a space. An air flow flowing into the first or second side face wets over mutually facing cooling surfaces 30s and the heat mass through the slots to dissipate heat.;COPYRIGHT: (C)2004,JPO
机译:解决的问题:提供一种高性能的冷却装置,其包括具有至少一个表面的热物质,该表面具有尽可能多的散热片,以使可用于去除废热的表面积最大化。与部件热连接的冷却装置10包括热量20。臂19向外延伸,与热质20接触。翼23,其连接有从臂向下延伸并从臂向外延伸的肋21。多个散热片30与散热块的纵轴几乎对准,并与散热块的上表面和臂的上,下表面连接。包括形成侧流冷却装置的第一侧面2和第二侧面4的彼此面对的端部边缘,并且在翅片之间形成有间隙的狭缝。流入第一侧面或第二侧面的气流会在相互面对的冷却表面30s上浸湿,并且热量会通过狭缝散发热量,以散热。COPYRIGHT:(C)2004,JPO

著录项

  • 公开/公告号JP2004047954A

    专利类型

  • 公开/公告日2004-02-12

    原文格式PDF

  • 申请/专利权人 HEWLETT PACKARD CO HP;

    申请/专利号JP20030116695

  • 发明设计人 HEGDE SHANKAR;

    申请日2003-04-22

  • 分类号H01L23/36;F25D1/00;

  • 国家 JP

  • 入库时间 2022-08-21 23:32:45

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