METHODS TO PREDICT WORKING SHAPE, TO DETERMINE WORKING CONDITION, AND TO PREDICT WORKING AMOUNT, SYSTEMS TO PREDICT WORKING SHAPE, AND TO DETERMINE WORKING CONDITION, WORKING SYSTEM, COMPUTER PROGRAMS TO PREDICT WORKING SHAPE, AND TO DETERMINE WORKING CONDITION, PROGRAM RECORDING MEDIUM, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a prediction method which can predict correctly corresponding working shape when a working condition is given.;SOLUTION: In step S11, a model formula including a correction coefficient, i.e. the model formula which is determined corresponding to a prescribed working condition, is made. Next, in step S12, a simple working condition is set and a working is performed. Next, in step S13, the working shape is measured. In addition, in step S14, a correction coefficient is identified so that the calculated working shape by the model formula becomes similar to the actually obtained working shape. Then, in step S15, the working shape corresponding to the given working condition is estimated using the identified model formula.;COPYRIGHT: (C)2004,JPO