MANUFACTURE OF DUAL DAMASCENE WIRING OF FINE ELECTRONIC ELEMENT USING INORGANIC FILLER WHICH DOES NOT CONTAIN HYBRID TYPE LOW DIELECTRIC CONSTANT SUBSTANCE AND CARBON

摘要

PROBLEM TO BE SOLVED: To provide a manufacture of dual damascene wiring of a fine electronic element using an inorganic filler which does not contain hybrid type low dielectric constant substance and carbon.;SOLUTION: In a manufacture of the dual damascene wiring, an insulating film where a dual damascene region is formed is a hybrid type insulating film of 3.3 or less of a dielectric constant, and a via filler is made of an inorganic matter containing no carbon. Thus, the electrical characteristics are enhanced and a defect is prevented.;COPYRIGHT: (C)2004,JPO